	Standard Products
	Z-Bond
	Electronics
	ZnTe
	Custom Engineering
	Custom Configurations

Core Competencies

CZT Bonding – Z-bond® Ideal for Pixelated Detectors

Advantages with Z-Bond
Z-bond® epoxy uses a low temperature process so it doesn't damage ASIC's.
This is a patented process with over 20 years of research.
The Z-bond® epoxy contains 0% Lead making it ideal for medical instrumentation. Currently, <250micron pixels can be bonded using Z-Bond.
Future plans for Z-Bond are to achieve <50micron pixel pitches.

Mounting substrate with Z-bond® (fibers/epoxy medium) and CdZnTe radiation detector.

Parts are put into a Special Magnetic System to align fibers to make contact between substrate and CdZnTe.

CdZnTe radiation detector mounted with Z-Bond to Substrate or Directly to ASIC.
Currently 200micron pixel pitch capability.

Note
Z-Resistance: <3 Ω (Maximum) (dependent on interconnect count)
X/Y Resistance: >10¹³ Ω between interconnects