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Cutting / Sawing
The slicing and dicing of our proprietary CdZnTe crystals is the first step in converting the raw crystal ingots into radiation detectors of various configurations. In our state-of-the-art precision wire-saw and dicing facility we ensure that tight dimensional tolerances and quality are maintained. Characterization of the ingots prior to slicing ensures the finished detectors meet performance requirements and customer specifications.
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