Sensor Bonding

CZT Bonding – Z-bond® Ideal for Pixelated Detectors

Mounting substrate with Z-Bond (fibers/epoxy medium) and CdZnTe radiation detector.

Parts are put into a Special Magnetic System to align fibers to make contact between substrate and CdZnTe.

CdZnTe radiation detector mounted with Z-Bond to Substrate or Directly to ASIC.
Currently 200micron pixel pitch capability.

Note Z-Resistance: <3 Ω (Maximum) (dependent on interconnect count) X/Y Resistance: >1013 Ω between interconnects